On September 24-26, 2025, Nico (Qingdao) Polymer Technology Co., Ltd. participated in the 18th International Vacuum Exhibition held at the Shanghai World Expo Exhibition and Convention Center, and communicated ..

Nico (Qingdao) Polymer Technology Co., Ltd. is a comprehensive manufacturer of high-quality rubber products that integrates research and development design, precision manufacturing, and global sales...

<p>O-ring is mainly used for static sealing and reciprocating sealing. When used for rotary motion sealing, it is limited to low-speed rotary sealing devices. O-ring seals are generally installed in grooves with rectangular cross-sections on the outer or inner circle to provide sealing function. O-ring seals can still perform well in sealing and shock absorption environments that are resistant to oil, alkali, wear, and chemical erosion. Therefore, it is the most widely used seal in hydraulic and pneumatic transmission systems.</p>

<p style="text-align:justify">Large diameter O-rings usually refer to fluororubber O-rings with larger sizes (such as diameters ranging from 1mm to 9800mm). With its unique size specifications and high-quality fluororubber material, large-diameter O-rings exhibit many excellent characteristics, such as excellent high temperature and chemical corrosion resistance, outstanding sealing effect, low friction resistance, good self-lubricating properties, and easy installation.</p> <p style="text-align:justify"><br /> In summary, large-diameter O-rings play an indispensable role in modern industrial fields due to their outstanding performance and wide applicability. They not only significantly improve the operational reliability and efficiency of mechanical equipment, but also provide practical and effective solutions for sealing requirements under various complex working conditions.</p>

<p style="text-align:justify">X-shaped sealing ring, also known as star shaped sealing ring, has unique application characteristics. On the one hand, to reduce friction, the sealing ring can be installed in a dedicated groove with a low compression ratio; On the other hand, it can also adapt to O-ring grooves of the same specifications.</p> <p style="text-align:justify"><br /> X-shaped sealing rings have many advantages: they have low friction, can effectively overcome twisting problems, and can achieve better lubrication effects. In terms of sealing function, it can serve as a dynamic sealing element under low-speed motion conditions and is also suitable for static sealing scenarios. It can be said that the X-shaped sealing ring is an improvement and enhancement based on the performance of the O-ring, and its standard size is completely consistent with the American standard O-ring.</p> <p style="text-align:justify"><br /> X-shaped sealing rings are suitable for scenarios that require high precision, such as hydraulic cylinders and pneumatic equipment.</p>

<p style="text-align:justify"><strong>1. Sealing gasket for semiconductor equipment</strong></p> <p style="text-align:justify"><br /> In the semiconductor manufacturing process, various equipment and chambers need to maintain a high degree of sealing to prevent external pollutants from entering. This annular component is used as a sealing gasket and installed at the interface of the equipment to ensure sealing effectiveness.</p> <p style="text-align:justify"><br /> <strong>2. Positioning ring in wafer transfer system</strong></p> <p style="text-align:justify"><br /> In wafer transfer systems, precise positioning and transfer of wafers are required. This annular component may be used as a positioning ring to help the wafer maintain a stable and accurate position during transport.</p> <p style="text-align:justify"><br /> Uniformly distributed small holes are used to fix or adjust the position of the positioning ring, ensuring the accuracy of wafer transfer.</p> <p style="text-align:justify"><br /> <strong>3. Support rings in semiconductor packaging equipment</strong></p> <p style="text-align:justify"><br /> In the semiconductor packaging process, precise packaging and fixation of chips are required. This circular component is used as a support ring to help the chip maintain stability during the packaging process.</p> <p style="text-align:justify"><br /> <strong>4. Contact rings in semiconductor testing equipment</strong></p> <p style="text-align:justify"><br /> In the semiconductor testing process, electrical testing of the chip is required. This annular component is used as a contact ring to assist in testing the electrical contact between the probe and the chip.</p> <p style="text-align:justify"><br /> Uniformly distributed small holes are used to secure test probes, ensuring the stability and reliability of electrical contact.</p> <p style="text-align:justify">&nbsp;</p> <p style="text-align:justify"><strong>5. Thermal insulation ring in semiconductor reaction chamber</strong></p> <p style="text-align:justify"><br /> In the semiconductor reaction chamber, high-temperature treatment is required for the chip. This circular component is used as an insulation ring to help reduce heat conduction and protect the chip from overheating.</p>

<p style="text-align:justify"><span style="font-size:28px"><strong>Core material combination:</strong></span></p> <p style="text-align:justify"><br /> <strong>Outer plastic:</strong></p> <p style="text-align:justify"><br /> FEP (Fluorinated Ethylene Propylene): Temperature resistant to -80 ℃~205 ℃, resistant to hydrofluoric acid and concentrated sulfuric acid<br /> PFA (Fusible Polytetrafluoroethylene): Temperature resistance -200 ℃~260 ℃, resistance to aqua regia and organic solvents</p> <p style="text-align:justify"><br /> <strong>Inner rubber:</strong><br /> Fluororubber (FKM): resistant to high temperatures up to 180 ℃, resistant to mineral oil and synthetic hydraulic oil<br /> Silicone rubber (VMQ): resistant to -60 ℃ low temperature, physiologically inert (FDA certified)</p> <p style="text-align:justify"><br /> <span style="font-size:28px"><strong>Performance breakthrough:</strong></span></p> <p style="text-align:justify"><br /> <strong>Chemical resistance: </strong>According to ASTM D543 standard, it can resist environments with 98% concentrated sulfuric acid, 30% sodium hydroxide, and chlorine gas</p> <p style="text-align:justify"><br /> <strong>Friction coefficient: </strong>FEP+fluorine rubber static&lt;0.15, dynamic&lt;0.25 (surface polishing treatment)</p> <p style="text-align:justify"><br /> <strong>Leakage rate:</strong> Helium mass spectrometry detection&lt;1 &times; 10 ⁻⁹ Pa &middot; m &sup3;/s (applicable for vacuum sealing)</p> <p style="text-align:justify"><br /> Application scenarios: Semiconductor equipment wafer transfer, chemical reactor stirring shaft, pharmaceutical sterile pipeline, deep-sea exploration equipment.</p> <p>&nbsp;</p> <p>&nbsp;</p>

<p style="text-align:justify"><strong>Core performance:</strong></p> <p style="text-align:justify"><br /> &bull; Resistant to plasma etching (CF4/O2 mixed gas)</p> <p style="text-align:justify"><br /> &bull; Temperature resistance range: -50 ℃~250 ℃ (instantaneous 300 ℃)</p> <p style="text-align:justify"><br /> &bull; Dynamic sealing life&gt;1 million cycles</p> <p style="text-align:justify"><br /> &bull; Particle release amount&lt;10 particles/ft &sup3; (0.1 &mu; m or more)</p> <p style="text-align:justify"><br /> Application scenarios: wafer transfer chambers, etching machines, CVD/PVD equipment, vacuum gate valves for lithography machines.</p> <p style="text-align:justify"><br /> <strong>Nico Rubber Door Valve Solution:</strong></p> <p style="text-align:justify"><br /> <strong>&bull; Integrated seamless design:</strong> eliminates leakage hazards</p> <p style="text-align:justify"><br /> <strong>&bull;Self lubricating coating: </strong>reduces the generation of friction particles</p> <p style="text-align:justify"><br /> <strong>&bull;Quick exhaust structure:</strong> Shorten machine vacuum pumping time by 30%</p>

<h2 style="margin-bottom:2px; text-align:left; text-indent:0.0000pt">Chip cutting suction cups play a crucial role in the semiconductor manufacturing process. They not only ensure high precision and stability in wafer processing, but also have advantages such as high temperature resistance, chemical stability, and long service life. They are indispensable tools for achieving high-quality chip manufacturing.</h2>