Product Display

1. Sealing gasket for semiconductor equipment

In the semiconductor manufacturing process, various equipment and chambers need to maintain a high degree of sealing to prevent external pollutants from entering. This annular component is used as a sealing gasket and installed at the interface of the equipment to ensure sealing effectiveness.

2. Positioning ring in wafer transfer system

In wafer transfer systems, precise positioning and transfer of wafers are required. This annular component may be used as a positioning ring to help the wafer maintain a stable and accurate position during transport.

Uniformly distributed small holes are used to fix or adjust the position of the positioning ring, ensuring the accuracy of wafer transfer.

3. Support rings in semiconductor packaging equipment

In the semiconductor packaging process, precise packaging and fixation of chips are required. This circular component is used as a support ring to help the chip maintain stability during the packaging process.

4. Contact rings in semiconductor testing equipment

In the semiconductor testing process, electrical testing of the chip is required. This annular component is used as a contact ring to assist in testing the electrical contact between the probe and the chip.

Uniformly distributed small holes are used to secure test probes, ensuring the stability and reliability of electrical contact.

5. Thermal insulation ring in semiconductor reaction chamber

In the semiconductor reaction chamber, high-temperature treatment is required for the chip. This circular component is used as an insulation ring to help reduce heat conduction and protect the chip from overheating.